characteristic         

cause Mei-Ho（ Meiyan independently develops and manufactures high-quality wafer grinding wheels for semiconductor silicon wafer grinding and thinning processes. In addition to efficiently grinding wafer products, the design strengthens the grinding water inlet hole for more uniform and stable grinding. Customized services can maintain superior cutting capabilities on different materials and specifications, thereby achieving stable grinding performance and optimal grinding wheel service life.

purpose

● Grinding wheel size

18 inch wafer using 200mm
12 inch wafer using 300mm

● Grinding wheel particle size
・＃320 ・＃1000
・＃360 ・＃1500
・＃400 ・＃2000

・＃600 ・＃3000
・＃800 ・＃8000