Mei-Ho Meihe Enterprise Co., Ltd. established the PCB Abrasive Materials Business Unit in 2008 and cooperated with Nikken Japan Research Paper Co., Ltd. to develop abrasive materials for HDI/IC/FC high-order carrier plates. In 2012, it established a subsidiary company in Dongguan City, the United States. Research Optoelectronics Co., Ltd., FPC Soft Board Division, Wafer Semiconductor Business Unit, Mei-Ho has so far spanned many industries, and its services include the development and sales of precision grinding machine tools, electronics, wafer grinding materials, and optoelectronic materials. Main products are: grinding equipment, ceramic & non-woven brush wheel, laminated steel plate, burned iron plate, enamel aluminum foil, silicone pad, vacuum balloon, glass fiber cloth, wafer grinding wheel and so on.